Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6555462 | Semiconductor device having stress reducing laminate and method for manufacturing the same | Chang-Hun Lee | 2003-04-29 |
| 6552438 | Integrated circuit bonding pads including conductive layers with arrays of unaligned spaced apart insulating islands therein and methods of forming same | Soo-Cheol Lee, Kyoung-Mok Son, Heon-Jong Shin, Hyae-Ryoung Lee, Young Pill Kim +3 more | 2003-04-22 |
| 6548862 | Structure of semiconductor device and method for manufacturing the same | Hyuk-Ju Ryu | 2003-04-15 |