Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6605865 | Semiconductor package with optimized leadframe bonding strength | Jung Ho Jeong, Eun-Deok Kim | 2003-08-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6605865 | Semiconductor package with optimized leadframe bonding strength | Jung Ho Jeong, Eun-Deok Kim | 2003-08-12 |