Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6581820 | Lead bonding method for SMD package | Jong-Sung Jung, Jong Tae Kim, Chang Dug KIM | 2003-06-24 |
GY
Guem-Young Youn
Overall (2003): #217,797 of 273,478Top 80%
1
Patents 2003