Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6629876 | Apparatus for grinding wafers using a grind chuck having a high elastic modulus | Jin Heung Kim, Do-yun Hwang | 2003-10-07 |
BP
Bae-seung Park
Overall (2003): #258,816 of 273,478Top 95%
1
Patents 2003