Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6649506 | Method of fabricating vias in solder pads of a ball grid array (BGA) substrate | — | 2003-11-18 |
| 6574863 | Thin core substrate for fabricating a build-up circuit board | I-Chung Tung, Han-Kun Hsieh | 2003-06-10 |
| 6576540 | Method for fabricating substrate within a Ni/Au structure electroplated on electrical contact pads | Chiang-Du Chen, Yen-Hung Liu | 2003-06-10 |
| 6543676 | Pin attachment by a surface mounting method for fabricating organic pin grid array packages | I-Chung Tung | 2003-04-08 |