Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6571007 | Ball-arranging substrate for forming bump, ball-arranging head, ball-arranging device, and ball-arranging method | Kenji Shimokawa, Eiji Hashino | 2003-05-27 |
| 6509645 | Spherical semiconductor device and method for fabricating the same | Kenji Shimokawa, Eiji Hashino, Nobuo Takeda, Atsuyuki Fukano | 2003-01-21 |