Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6611063 | Resin-encapsulated semiconductor device | Tomoko Takizawa, Hirokazu Honda, Keiichirou Kata | 2003-08-26 |
| 6538305 | BGA type semiconductor device having a solder-flow damping/stopping pattern | — | 2003-03-25 |
| 6504244 | Semiconductor device and semiconductor module using the same | Tomoko Takizawa | 2003-01-07 |