Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6670706 | Semiconductor device including a semiconductor pellet having bump electrodes connected to pad electrodes of an interconnect board and method for manufacturing same | — | 2003-12-30 |
| 6653171 | Flip-chip type semiconductor device having split voids within under-fill layer and its manufacturing method | — | 2003-11-25 |
| 6617688 | Semiconductor device and flat electrodes | Nobuaki Nagai | 2003-09-09 |
| 6608372 | Surface mountable chip type semiconductor device and manufacturing method | — | 2003-08-19 |
| 6504240 | Semiconductor device having reliable coupling between wiring substrate and semiconductor pellet | — | 2003-01-07 |