Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6640436 | Method of fabricating a coated metallic wire, method of removing insulation from the coated metallic wire and method of fabricating a semiconductor device with the wire | Takahiro Ito | 2003-11-04 |
| 6621156 | Semiconductor device having stacked multi chip module structure | — | 2003-09-16 |
| 6605869 | Semiconductor device with improved cooling efficiency and reduced electric resistance | — | 2003-08-12 |
| 6600221 | Semiconductor device with stacked semiconductor chips | — | 2003-07-29 |
| 6575348 | Wire bonding apparatus with spurious vibration suppressing structure | Hidemi Matsukuma | 2003-06-10 |