Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6507112 | Semiconductor device with an improved bonding pad structure and method of bonding bonding wires to bonding pads | Toshimichi Kurihara, Tetsu Toda | 2003-01-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6507112 | Semiconductor device with an improved bonding pad structure and method of bonding bonding wires to bonding pads | Toshimichi Kurihara, Tetsu Toda | 2003-01-14 |