Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6642079 | Process of fabricating flip chip interconnection structure | Cheng-Yi Liu, Shen-Jie Wang | 2003-11-04 |
| 6602777 | Method for controlling the formation of intermetallic compounds in solder joints | Cheng-En Ho | 2003-08-05 |