Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6571469 | Method for manufacturing modular board | Kazuyoshi Nakaya, Hiroyuki Nakaji, Hirofumi Doi, Iku Nagai, Junichi Nakasone | 2003-06-03 |
| 6534726 | Module substrate and method of producing the same | Tomoyuki Koide, Kazuyoshi Nakaya, Hiroyuki Nakaji | 2003-03-18 |
| 6523734 | Method for joining wiring boards and manufacturing data carrier and device for mounting electronic component modules | Wakahiro Kawai | 2003-02-25 |