Issued Patents 2003
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6670701 | Semiconductor module and electronic component | Tetsuya Matsuura, Yasushi Kasatani, Hajime Maeda | 2003-12-30 |
| 6614101 | Lead frame with raised leads and plastic packaged semiconductor device using the same | Kazuyuki Misumi, Manabu Horita | 2003-09-02 |
| 6583511 | Semiconductor device and a method of producing the same | Tatsuhiko Akiyama | 2003-06-24 |
| D475981 | Integrated circuits substrate | — | 2003-06-17 |
| 6552418 | Resin-encapsulated semiconductor device | Kazuyuki Misumi | 2003-04-22 |
| 6545366 | Multiple chip package semiconductor device | Tatsuhiko Akiyama | 2003-04-08 |
| 6518652 | Semiconductor package | Yasuki Takata, Hiroshi Horibe | 2003-02-11 |