BH

Brian D. Harry

HD High Connection Density: 1 patents #5 of 14Top 40%
📍 Redmond, WA: #95 of 338 inventorsTop 30%
🗺 Washington: #1,140 of 3,868 inventorsTop 30%
Overall (2003): #255,248 of 273,478Top 95%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6540525 High I/O stacked modules for integrated circuits Che-Yu Li, David A. Lysack, John J. Kresse 2003-04-01