Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6576531 | Method for cutting semiconductor wafers | Neo Chee Peng, Tan Hock Chuan, Ho Seng, Chew Beng Chye, Lim Guek Har | 2003-06-10 |
| 6514797 | Underfill applications using film technology | Tay Liang Chee, Toh Kok Seng | 2003-02-04 |