Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6655022 | Implementing micro BGA assembly techniques for small die | Richard Foehringer, Deborah S. Kaller | 2003-12-02 |
| 6605875 | Integrated circuit die having bond pads near adjacent sides to allow stacking of dice without regard to dice size | — | 2003-08-12 |
| 6547570 | IC package with quick connect feature | Jeffrey C. Franz, David S. Brannam | 2003-04-15 |