Issued Patents 2003
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6664646 | Chip-on-board assemblies, carrier assemblies and carrier substrates using residual organic compounds to facilitate gate break | — | 2003-12-16 |
| 6583504 | Semiconductor die with attached heat sink and transfer mold | — | 2003-06-24 |
| 6576057 | Method and apparatus for application of spray adhesive to a leadframe for chip bonding | — | 2003-06-10 |
| 6555898 | Dam structure for center-bonded chip package | — | 2003-04-29 |
| 6555412 | Packaged semiconductor chip and method of making same | — | 2003-04-29 |
| 6545368 | Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device | — | 2003-04-08 |
| 6524960 | Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device | — | 2003-02-25 |
| 6518186 | Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device | — | 2003-02-11 |