Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6611052 | Wafer level stackable semiconductor package | Chia Yong Poo, Boon Suan Jeung, Chan Min Yu, Neo Yong Loo, Chua Swee Kwang | 2003-08-26 |
| 6582992 | Stackable semiconductor package and wafer level fabrication method | Chia Yong Poo, Boon Suan Jeung, Chan Min Yu, Neo Yong Loo, Chua Swee Kwang | 2003-06-24 |