Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6652799 | Method for molding semiconductor components | Toh Kok Seng, Kay Kit-Tan | 2003-11-25 |
| 6544816 | Method of encapsulating thin semiconductor chip-scale packages | Tiang Hock Lim | 2003-04-08 |