CC

Craig T. Clyne

Micron: 3 patents #225 of 831Top 30%
📍 Boise, ID: #128 of 574 inventorsTop 25%
🗺 Idaho: #175 of 1,039 inventorsTop 20%
Overall (2003): #32,345 of 273,478Top 15%
3
Patents 2003

Issued Patents 2003

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
6652138 Semiconductor wire bond machine leadframe thermal map system 2003-11-25
6634538 Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits Sven Evers 2003-10-21
6588649 Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits Sven Evers 2003-07-08