Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6670217 | Methods for forming a die package | Mark R. Boone | 2003-12-30 |
| 6626931 | Implantable medical electronics using high voltage flip chip components | Mark R. Boone | 2003-09-30 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6670217 | Methods for forming a die package | Mark R. Boone | 2003-12-30 |
| 6626931 | Implantable medical electronics using high voltage flip chip components | Mark R. Boone | 2003-09-30 |