Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6650008 | Stacked semiconductor packaging device | Chen-Jung Tsai, Chih-Wen Lin | 2003-11-18 |
| 6559526 | Multiple-step inner lead of leadframe | Chen-Jung Tsai, Chih-Wen Lin | 2003-05-06 |