Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6617517 | Multi-layer structure having a thermal interface with low contact resistance between a microelectronic component package and a heat sink | Richard F. Hill | 2003-09-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6617517 | Multi-layer structure having a thermal interface with low contact resistance between a microelectronic component package and a heat sink | Richard F. Hill | 2003-09-09 |