Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6529790 | Computation of die-per-wafer considering production technology and wafer size | Michael R. Magee, Wesley R. Erck | 2003-03-04 |
| 6522940 | Method and system for varying die shape to increase wafer productivity | Wesley R. Erck, Michael R. Magee | 2003-02-18 |