Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6534873 | Semiconductor package and printed wiring board for semiconductor package | Kenji Sasaoka | 2003-03-18 |
| 6507995 | Apparatus for manufacturing a wiring substrate | Kenji Sasaoka, Fumitoshi Ikegaya, Takahiro Mori, Tomohisa Motomura, Koichiro Shibayama | 2003-01-21 |