Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6649516 | Method for manufacturing a composite member from a porous substrate by selectively infiltrating conductive material into the substrate to form via and wiring regions | Koji Asakawa, Yasuyuki Hotta, Toshiro Hiraoka | 2003-11-18 |