Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6605522 | Method of manufacturing a semiconductor device having a protruding bump electrode | Hirokazu Ezawa | 2003-08-12 |
| 6569752 | Semiconductor element and fabricating method thereof | Soichi Homma, Hirokazu Ezawa, Junichiro Yoshioka, Hiroaki Inoue, Tsuyoshi Tokuoka | 2003-05-27 |