Issued Patents 2003
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6661943 | Fiber-free optical interconnect system for chip-to-chip signaling | — | 2003-12-09 |
| 6657275 | Pad and via placement design for land side capacitors | Chee-Yee Chung, David G. Figueroa | 2003-12-02 |
| 6636416 | Electronic assembly with laterally connected capacitors and manufacturing method | Chee-Yee Chung | 2003-10-21 |
| 6624444 | Electrical-optical package with capacitor DC shunts and associated methods | — | 2003-09-23 |
| 6599031 | Optical/electrical interconnects and package for high speed signaling | — | 2003-07-29 |
| 6580611 | Dual-sided heat removal system | Gilroy Vandentop, Raj Nair, Chia-Pin Chiu | 2003-06-17 |
| 6559484 | Embedded enclosure for effective electromagnetic radiation reduction | Chee-Yee Chung, David G. Figueroa | 2003-05-06 |
| 6558169 | Shunt power connection for an integrated circuit package | David G. Figueroa, Hong Xie | 2003-05-06 |
| 6519134 | Universal capacitor terminal design | David G. Figueroa | 2003-02-11 |
| 6509640 | Integral capacitor using embedded enclosure for effective electromagnetic radiation reduction | Chee-Yee Chung, David G. Figueroa | 2003-01-21 |