Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6667225 | Wafer-bonding using solder and method of making the same | Christine Hau-Riege | 2003-12-23 |
| 6579795 | Method of making a semiconductor device that has copper damascene interconnects with enhanced electromigration reliability | — | 2003-06-17 |