Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6617683 | Thermal performance in flip chip/integral heat spreader packages using low modulus thermal interface material | Vassoudevane Lebonheur | 2003-09-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6617683 | Thermal performance in flip chip/integral heat spreader packages using low modulus thermal interface material | Vassoudevane Lebonheur | 2003-09-09 |