Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6622905 | Design and assembly methodology for reducing bridging in bonding electronic components to pads connected to vias | Phil Geng, Scott Dixon | 2003-09-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6622905 | Design and assembly methodology for reducing bridging in bonding electronic components to pads connected to vias | Phil Geng, Scott Dixon | 2003-09-23 |