Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6651869 | Methods and electronic board products utilizing endothermic material for filling vias to absorb heat during wave soldering | Raiyomand Aspandiar, Tom E. Pearson | 2003-11-25 |
| 6523801 | Component placement | Jay Hall | 2003-02-25 |