Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6667090 | Coupon registration mechanism and method | David Boggs, Rebecca Jessep, Daryl Sato, John Dungan | 2003-12-23 |
| 6630631 | Apparatus and method for interconnection between a component and a printed circuit board | Terrance Dishongh | 2003-10-07 |
| 6580174 | Vented vias for via in pad technology yield improvements | Rebecca Jessep, John Dungan, David Boggs, Daryl Sato | 2003-06-17 |
| 6509530 | Via intersect pad for electronic components and methods of manufacture | Tom E. Pearson, Jayne Mershon | 2003-01-21 |