Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6664176 | Method of making pad-rerouting for integrated circuit chips | Harry Hedler, Thorsten Meyer, Stefan Ruckmich | 2003-12-16 |
| 6638870 | Forming a structure on a wafer | Axel Brintzinger, Harry Hedler | 2003-10-28 |
| 6521512 | Method for fabricating a thin, free-standing semiconductor device layer and for making a three-dimensionally integrated circuit | — | 2003-02-18 |