Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6590282 | Stacked semiconductor package formed on a substrate and method for fabrication | Hsing-Seng Wang, Chia-Chung Wang | 2003-07-08 |
| 6536653 | One-step bumping/bonding method for forming semiconductor packages | Hsing-Seng Wang, Chiang-Han Day | 2003-03-25 |