Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6506269 | High-strength and high-conductivity Cu-(Ni, Co, Fe)-Si copper alloy for use in leadframes and method of making the same | Jin Liu, Yu-Lian Sha, Mao-Ying Teng, Ray-Iun Liu, Ren-Der Jean | 2003-01-14 |