Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6632372 | Method of forming via-holes in multilayer circuit boards | Man-Lin Chen, Hsien-Kuang Lin, Tien-Shou Shieh, Pey-Ching Liou | 2003-10-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6632372 | Method of forming via-holes in multilayer circuit boards | Man-Lin Chen, Hsien-Kuang Lin, Tien-Shou Shieh, Pey-Ching Liou | 2003-10-14 |