Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6657864 | High density thermal solution for direct attach modules | Edward R. Pillai, Jeffrey A. Zitz | 2003-12-02 |
| 6583498 | Integrated circuit packaging with tapered striplines of constant impedance | Edward R. Pillai, Deana Cosmadelis | 2003-06-24 |