Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6559543 | Stacked fill structures for support of dielectric layers | Howard S. Landis, William T. Motsiff | 2003-05-06 |
| 6528883 | Shapes-based migration of aluminum designs to copper damascene | Ezra D. B. Hall, Howard S. Landis, Mark A. Lavin, William C. Leipold | 2003-03-04 |