Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6605526 | Wirebond passivation pad connection using heated capillary | Wayne J. Howell, William T. Motsiff, Jean-Guy Quintal, Sylvain Ouimet | 2003-08-12 |
| 6600213 | Semiconductor structure and package including a chip having chamfered edges | Donald W. Brouillette, Robert F. Cook, Thomas G. Ference, Wayne J. Howell, Eric G. Liniger | 2003-07-29 |