Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6548175 | Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof | Krishna G. Sachdev, Amy B. Ostrander, Charles H. Perry, Megan J. Shannon | 2003-04-15 |
| 6541305 | Single-melt enhanced reliability solder element interconnect | Mukta G. Farooq | 2003-04-01 |
| 6528352 | Use of conductive adhesive to form temporary electrical connections for use in TCA (temporary chip attach) applications | John U. Knickerbocker, Thomas E. Lombardi, Amy B. Ostrander | 2003-03-04 |