LR

Lubomyr T. Romankiw

IBM: 1 patents #1,943 of 5,539Top 40%
📍 Briarcliff Manor, NY: #11 of 23 inventorsTop 50%
🗺 New York: #3,048 of 9,423 inventorsTop 35%
Overall (2003): #170,040 of 273,478Top 65%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6596624 Process for making low dielectric constant hollow chip structures by removing sacrificial dielectric material after the chip is joined to a chip carrier 2003-07-22