Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6656770 | Thermal enhancement approach using solder compositions in the liquid state | Eugene Atwood, Giulio DiGiacomo, Horatio Quinones | 2003-12-02 |
| 6504105 | Solder ball connections and assembly process | John Acocella, Donald R. Banks, Thomas Caulfield, Karl G. Hoebener, David P. Watson +1 more | 2003-01-07 |