Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6586352 | Method for reducing coefficient of thermal expansion in chip attach packages | Lawrence Robert Blumberg, Robert M. Japp, William J. Rudik | 2003-07-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6586352 | Method for reducing coefficient of thermal expansion in chip attach packages | Lawrence Robert Blumberg, Robert M. Japp, William J. Rudik | 2003-07-01 |