Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6638352 | Thermal stable low elastic modulus material and device using the same | Yuichi Satsu, Morimichi Umino, Takumi Ueno, Akio Takahashi, Akira Nagai +2 more | 2003-10-28 |
| 6638631 | Thermal stable low elastic modulus material and device using the same | Yuichi Satsu, Morimichi Umino, Takumi Ueno, Akio Takahashi, Akira Nagai +2 more | 2003-10-28 |
| 6627997 | Semiconductor module and method of mounting | Shuji Eguchi, Akira Nagai, Haruo Akahoshi, Takumi Ueno, Masahiko Ogino +3 more | 2003-09-30 |
| 6621154 | Semiconductor apparatus having stress cushioning layer | Masahiko Ogino, Tadanori Segawa, Takao Miwa, Akira Nagai, Akihiro Yaguchi +2 more | 2003-09-16 |