TI

Takayuki Itsuji

HI Hitachi: 1 patents #1,745 of 4,225Top 45%
HC Hitachi Car Engineering Co.: 1 patents #51 of 145Top 40%
📍 Hitachinaka, MI: #4 of 6 inventorsTop 70%
Overall (2003): #110,415 of 273,478Top 45%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6541364 Bump forming method and bump forming apparatus Hideki Mukuno, Jun Matsui, Kaoru Uchiyama, Kunio Kondo 2003-04-01