SI

Seiichi Ichihara

HI Hitachi: 1 patents #1,745 of 4,225Top 45%
Overall (2003): #122,517 of 273,478Top 45%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6645794 Method of manufacturing a semiconductor device by monolithically forming a sealing resin for sealing a chip and a reinforcing frame by transfer molding Noriyuki Takahashi, Chuichi Miyazaki 2003-11-11