Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6569764 | Method of manufacturing a semiconductor package by attaching a lead frame to a semiconductor chip via projecting electrodes and an insulating sheet of resin material | Toshinori Hirashima, Yasushi Takahashi, Masahiro Koizumi, Munehisa Kishimoto | 2003-05-27 |