Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6551858 | Method of producing a semiconductor device having two semiconductor chips sealed by a resin | Youichi Kawata, Michiaki Sugiyama, Atsushi Fujishima, Yasuyuki Nakajima, Takatoshi Hagiwara | 2003-04-22 |