SO

Shingo Ohsaka

HI Hitachi: 1 patents #1,745 of 4,225Top 45%
HS Hitachi Hokkai Semiconductor: 1 patents #4 of 11Top 40%
📍 Hakodate, JP: #1 of 3 inventorsTop 35%
Overall (2003): #119,398 of 273,478Top 45%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6590275 Ball grid array type semiconductor package having a flexible substrate Atsushi Fujisawa, Takafumi Konno, Ryo Haruta, Masahiro Ichitani 2003-07-08